Mr. Arif Ul Alam

Department:
Electronics and Telecommunication Engineering

Research Interest:
Nanoelectronics, Wafer Bonding, MEMS, Carbon Nanotube/Graphene, 2D materials
Research Affiliation:
Micro and Nano Systems Laboratory (http://www.mnsl-mcmaster.ca/)
Membership:
IEEE Student Member
Teaching Interest:
Microelectronics, Fiber Optic Communication Technology, Semiconductor Device Physics
Teaching Year:
February 2009 - August 2011
Courses Taught:

ETE 101: Electrical Circuits
ETE 202: Electronics Devices and Circuits-I
ETE 204: Digital Electronics
ETE 210: Signals and Systems
ETE 310: Telecommunication Switching and Networks
ETE 311: Control System Engineering
ETE 454: Optical Fiber Network
ETE 463: Optical Fiber Communications
PHY-101: Physics-I (Waves Oscillation and Modern Physics)
PHY-201: Physics-II (Electricity, Magnetism and Optics)

Title:
Surface Analysis of Materials for Direct Wafer Bonding

Authors:
Arif Ul Alam

Abstract:

Surface preparation and its exposure to different processing conditions is a key step in heterogeneous integration of electronics, photonics, fluidics and/or mechanical components for More-than-Moore applications. Therefore, it is critical to understand how various processing and environmental conditions affect the surface properties of bonding substrates. In this thesis, the effects of oxygen reactive-ion etching (O2 RIE) plasma followed by storage in ambient and 98% relative humidity on some key surface properties such as roughness, water contact angle, hardness, and the elemental and compositional states of three materials – silicon (Si), silicon dioxide (SiO2) and glass – are investigated to analyze their influence on bondability. Lower O2 RIE plasma activation times cause low surface roughness, high surface reactivity and high hydrophilicity of Si, SiO2 and glass. The decrease of hardness of Si and SiO2 with increased activation time is attributed to higher surface roughness and formation of amorphous layers of Si. While contact angle and surface roughness results show correlation with bondability, the role of hardness on bondability requires further investigation. The high-resolution X-ray Photoelectron Spectroscopy (XPS) spectra of O2 RIE treated Si, SiO2 and glass showed the presence of Si(-O)2 resulting in highly reactive surfaces. The high surface reactivity of Si, SiO2 and glass obtained from oxygen plasma activation at lower activation times can result in better bondability. Also, the ambient humidity-induced Si(-OH)x plays an important role in the hydrophilic wafer bonding of Si and SiO2 which may require a low temperature heating.



File:
Surface_Analysis_of_Materials_for_Direct_Wafer_Bonding.pdf

Link:
http://digitalcommons.mcmaster.ca/opendissertations/8463/

Keywords:
Electronic Devices and Semiconductor Manufacturing, Nanotechnology fabrication, Semiconductor and Optical Materials


Title:
The Effects of Oxygen Plasma and Humidity on Surface Roughness, Water Contact Angle and Hardness of Silicon, Silicon Dioxide and Glass

Authors:
Arif Ul Alam, Matiar R Howlader, M Jamal Deen

Abstract:

For heterogeneous integration in many More-than-Moore applications, surface preparation is the key step to realize well-bonded multiple substrates for electronics, photonics, fluidics and/or mechanical components without degradation in performance. Therefore, it is critical to understand how various processing and environmental conditions affect their surface properties. In this paper, we investigated the effects of oxygen plasma and humidity on some key surface properties such as water contact angle, roughness and hardness of three materials – silicon (Si), silicon dioxide (SiO2) and glass, and their impact on bondability. The low surface roughness, high surface reactivity and high hydrophilicity of Si, SiO2 and glass at lower activation times can result in better bondability. Although, the surface reactivity of plasma-ambient-humidity-treated Si and SiO2 is considerably reduced, their reduction of roughness and increase of hydrophilicity may enable good bonding at low temperature heating due to augmented hydroxyl groups. The decrease of hardness of Si and SiO2 with increased activation time is attributed to higher surface roughness and formation of amorphous layers of Si. While contact angle and surface roughness results show correlation with bondability, the role of hardness on bondability requires further investigation.



File:
The_Effects_of_Oxygen_Plasma_and_Humidity_on_Surface_Roughness,_Water_Contact_Angle_and_Hardness_of_Silicon,_Silicon_Dioxide_and_Glass.pdf

Link:
http://iopscience.iop.org/0960-1317/24/3/035010

Keywords:
Surface Roughness, Water Contact Angle, Surface Hardness, Oxygen Plasma, Humidity, Integration, Boniding


Title:
Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding

Authors:
Arif Ul Alam, Matiar R Howlader, M Jamal Deen

Abstract:

Surface and interface characteristics of substrates are critical for reliable wafer bonding. Understanding the elemental and compositional states of surfaces after various processing conditions is necessary when bonding dissimilar materials. Therefore, we investigated the elemental and compositional states of silicon (Si), silicon dioxide (SiO2) and glass surfaces exposed to oxygen reactive ion etching (O2 RIE) plasma followed by storage in controlled humidity and/or ambient atmospheric conditions to understand the chemical mechanisms in the direct wafer bonding. High-resolution X-ray Photoelectron Spectroscopy (XPS) spectra of O2 RIE treated Si, SiO2 and glass showed the presence of Si(-O)2 resulting in highly reactive surfaces. A considerable shift in the binding energies of Si(-O)2, Si(-O)4 and Si(-OH)x were observed only in Si due to plasma oxidation of the surface. The humidity and ambient storage of plasma activated Si and SiO2 increased Si(-OH)x due to enhanced sorption of hydroxyls. The amounts of Si(-O)2 and Si(-OH)x of Si varied in different humidity storage conditions which are attributed to crystal-orientation dependent surface morphology and oxidation. The O2 RIE plasma induced high surface reactivity and humidity induced Si(-OH)x can play an important role in the hydrophilic wafer bonding with low temperature heating.



File:
Oxygen_Plasma_and_Humidity_Dependent_Surface_Analysis_of_Silicon,_Silicon_Dioxide_and_Glass_for_Direct_Wafer_Bonding.pdf

Link:
http://jss.ecsdl.org/content/2/12/P515.full

Keywords:
Electronic Devices and Semiconductor Manufacturing, Nanotechnology fabrication, Semiconductor and Optical Materials


Title:
A more appropriate Protein Classification using Data Mining

Authors:
Muhammad Mahbubur Rahman, Arif Ul Alam, Abdullah-Al-Mamun, Tamnun E Mursalin

Abstract:

Research in bioinformatics is a complex phenomenon as it overlaps two
knowledge domains, namely, biological and computer sciences. This paper has tried to introduce an efficient data mining approach for classifying proteins
into some useful groups by representing them in hierarchy tree structure. There are several techniques used to classify proteins but most of them had few drawbacks on their grouping. Among them the most efficient grouping technique is used by PSIMAP. Even though PSIMAP (Protein Structural Interactome Map) technique was successful to incorporate most of the protein but it fails to classify the scale free property proteins. Our technique overcomes this drawback and successfully maps all the protein in different groups, including the scale free property proteins failed to group by PSIMAP. Our approach selects the six major attributes of protein: a) Structure comparison b) Sequence Comparison c) Connectivity d) Cluster Index e) Interactivity f) Taxonomic to group the protein from the databank by generating a hierarchal tree structure. The proposed approach calculates the degree (probability) of similarity of each protein newly entered in the system against of existing proteins in the system by using probability theorem on each six properties of proteins. 



File:
A_more_appropriate_Protein_Classification_using_Data_Mining.pdf

Link:
http://arxiv.org/abs/1111.2514

Keywords:
Bioinformatics, Protein, Protein Grouping Techniques, PSIMAP, Scale Free Protein


Title:
Analysis of Visual Cortex Event Related FMRI Data using ICA Decomposition

Authors:
B Ahmed, AU Alam, MA Mamun, MEH Chowdhury, TE Mursalin

Abstract:

Independent Component Analysis (ICA) of Functional Magnetic Resonance Imaging (fMRI) data is commonly carried out under the assumption that each source may be represented as a spatially fixed pattern of activation. In this work, to detect and visualise variations in single-trial Hemodynamic Responses (HR) in event-related fMRI data, Infomax ICA algorithm has been used. Six subjects participated in four fMRI sessions. ICA decomposition of the resulting Blood Oxygenation Level-Dependent (BOLD) data from each session produced an independent component active in primary visual cortex. The BOLD-image plots demonstrated that component HRs varied substantially and often systematically across trials as well as across sessions, subjects, and brain areas.



File:
Analysis_of_Visual_Cortex_Event_Related_FMRI_Data_using_ICA_Decomposition.pdf

Link:
http://www.inderscience.com/info/inarticle.php?artid=44415

Keywords:
fMRI; functional magnetic resonance imaging; ICA decomposition; biomedical image processing; infomax ICA; EEG; electroencephalography; PET; positron emission tomography


Title:
RFID-based ticketing for public transport system: Perspective megacity Dhaka

Authors:
M.F.M. Hasan, G. Tangim, M.K. Islam, M.R.H. Khandokar, A.U. Alam

Abstract:

The paper based public transport ticketing system, prevailing in the megacity Dhaka (Bangladesh), introduces severe malfunction in the system, malicious argument among public, corruption and most of all traffic jam. This paper actually suggests a much more public friendly, automated system of ticketing as well as the credit transaction with the use of RFID based tickets. The total system mainly acts to bring out the consistency among various bus agencies that will conclude in uniform access of passengers in daily rides through an automated server being updated every single time the passengers travel by carrying the RFID based tickets.



File:
RFID-based_ticketing_for_public_transport_system_Perspective_megacity_Dhaka.pdf

Link:
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=5564067

Keywords:
RFID ticketing; Public transport system